Small radiators (or   radiators) are made from aluminum alloy sheets through stamping and surface treatment, while large radiators are made from aluminum alloy extrusions into profiles, which are then machined and surface treated. They come in various shapes and sizes for different device installations and devices with different power consumption.

Radiators are generally standard parts, and profiles can also be provided, which can be cut to a certain length by users according to their requirements to make non-standard radiators. The surface treatment of the radiator includes electrophoretic painting or black oxygen polarization treatment, whose purpose is to improve the heat dissipation efficiency and insulation performance.

It can be increased by 15% under natural cooling and 3% under ventilation cooling. Electrophoretic painting can withstand voltages of 500-800V.

The heat dissipation work of the U CPU chip can be divided into active heat dissipation and passive heat dissipation according to the heat dissipation method. Active cooling is very simple, it is to naturally dissipate the heat of the CPU chip into the air through the radiators.

Its heat dissipation effect is proportional to the size of the radiators. Its biggest advantage is that it does not require additional power consumption. This cooling method is often used in military or professional equipment that does not have special space requirements.

Passive cooling is mainly used for personal PCs. Passive cooling is to forcefully take away the heat emitted by the radiators through fans and other cooling devices. It is characterized by high heat dissipation efficiency and small device size.